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Metz Electronics Corporation - Electronic Contract Manufacturing

 


Quality Control


David Wilder
Quality Manager
Employee since 1983
Quality Manager since 1990
Interests: biking, computers, ATV's

Quality Control

  • Inspection per ANSI-IPC-A-610 standards.
  • 100% in process inspection using controlled documentation packages.
    1. Pre-wave solder inspection for component value, orientation and workmanship on all PCB assemblies.
    2. Final inspection for all post-wave solder operations, cleanliness and workmanship on all PCB assemblies.
    3. Custom inspection points created as needed.
  • Record keeping, distribution, analysis and corrective action when appropriate.
  • Incoming inspection of all procured material using MEC generated Q.V.L. from customer approved information.

Quality Assurance

  • Pre-ship audits using MIL Std 105D sampling plan with all lots rejected on one occurence.
  • Ramdom in-process audits of all systems.
  • Statistical Control Data Collection
    1. Wave soldering process
    2. Wire pull tests
  • Stamp Control System
    1. Circle used for Final Assembly.
    2. Triangle used for Test Operations.
    3. Square used for Final Inspection.
  • Participant in a supplier management program for a major O.E.M.
  • Participant in customer ship to stock programs.

MEC Product Safety Regulatory Compliance


Products can be manufactured and shipped under the following product safety programs at the customers request:

  • UL Recognized Component-Wiring Harnesses (ZPFW2) under file number E79950.
  • UL Recognized Component-Printing Wiring Assemblies (ZPV12) under file number E170244.
  • UL Recognized Component-Processed Wire (ZKLU2),(ZKLU8) under file number E205381.
  • CSA Certified Wiring Harness under file number LR 84759.

    MEC is also approved as a manufacturing site under UL,CSA, and TUV programs for various customer-specific products and can obtain certifications as needed at the customer's request.

 

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Copyright © 2000 Metz Electronics Corporation
Last modified: November 25, 2003